中财网狂野模式中速猎:电子辞典 - 封装2
来源：百度文库 编辑：中财网 时间：2024/04/29 08:08:10
电子辞典 共有专业词汇38514条
缩略语 全 称 中文解释
ZIP zigzag in-line package 锯齿双列封装
carrier, plastic leadless chip 塑料无引线芯片载体封装
potting 封装
packaging 封装
CADMP computer-aided design of microelectronicpackage 计算机辅助微电子封装设计
(CLCC) ceramic leaded chip carrier package 陶瓷式引线芯片载体封装
MC-QFP Metaillized Ceramic -Quad Flat Pack 金属化陶瓷--四方扁平封装
controlled collapse circuit connection packaging technology 控制熔塌[高度]电路连接封装技术
FPQFP fine pitch quad flat package 窄[引线]节距四边扁平封装
electronic packaging 电子封装
ceramic packaging 陶瓷封装
Packaging and Interconnecting Assembly 封装和互连装配
Packaging and Interconnecting Structure 封装和互连结构
packaging density 封装密度
packaging level 封装等级
packaging machine 包装机；封装机
packaging 封装；被覆，外层覆盖；插件
Metallized Ceramic - 金属化陶瓷－四方扁平封装
(CQFP) ceramic quad flat pack 陶瓷四方扁平封装
(CQFP) pack, ceramic quad flat 陶瓷四方扁平封装
缩略语 全 称 中文解释
ZIP zigzag in-line package 锯齿双列封装
carrier, plastic leadless chip 塑料无引线芯片载体封装
potting 封装
packaging 封装
CADMP computer-aided design of microelectronicpackage 计算机辅助微电子封装设计
(CLCC) ceramic leaded chip carrier package 陶瓷式引线芯片载体封装
MC-QFP Metaillized Ceramic -Quad Flat Pack 金属化陶瓷--四方扁平封装
controlled collapse circuit connection packaging technology 控制熔塌[高度]电路连接封装技术
FPQFP fine pitch quad flat package 窄[引线]节距四边扁平封装
electronic packaging 电子封装
ceramic packaging 陶瓷封装
Packaging and Interconnecting Assembly 封装和互连装配
Packaging and Interconnecting Structure 封装和互连结构
packaging density 封装密度
packaging level 封装等级
packaging machine 包装机；封装机
packaging 封装；被覆，外层覆盖；插件
Metallized Ceramic - 金属化陶瓷－四方扁平封装
(CQFP) ceramic quad flat pack 陶瓷四方扁平封装
(CQFP) pack, ceramic quad flat 陶瓷四方扁平封装